BCC9 profiles are made with EnzoTechs "One-Piece Forged Copper" technology which allows the closest structure and thus the best heat transfer!
BCC9 has more pins than the competition and the round design makes them extremely effective, even by passively use!
The profiles are made for use on graphics card BGA RAM, but can be used for mosfet on the motherboard and other chips that needs cooling.
The profiles uses a powerful 3M 8815 double sided thermal tape that ensures an easy and secure installation.
Unlike BMR-C1 profiles BCC9 is 5mm lower and thus Suitable for RAM under the spigots, of eg Swiftech MCW60-R and XSPC - X2O VGA Block.
Features:
* ATI© & NVIDIA© Compatible
* Pure forged copper
* Easy installation by using 3MT 8815 Thermal Tape
* Multipack - Eight (8) piece set
* Low profile
Specifications:
Model (Manufacturer No.): Enzotech BCC9 (BCC9)
Material: Forged C1100 copper, polished to.0003 "accuracy
Dimensions: 14 (L) mm x 14mm (W) x 9mm (H)
Weight: approx. 7g (per pcs)
Thermal tape: 3mt 8815 Thermal Tape
Compatibility:
All desired surfaces
Package content:
(8) Heat sink
Installation Instructions
Product code:
12ET006
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